Device Arena

Connectivity, superb picture and sound quality, and a unique mix of electronics, content and network services are just some of the features that distinguish Sony’s dazzling array of technology at CES 2012.
Sony is introducing consumers to a new world of connected products, from TVs, Blu-ray players, and home A/V receivers to tablets, smartphones, and PCs to camcorders, mobile audio devices and more. Combined with a broad range of online services for movies, TV shows, and games, as well as a cloud-based music service, Sony is giving consumers more access to more content whenever and however they want it. Through this convergence of hardware, content and network services, Sony is offering a new user experience.
“Sony is committed to designing technologies for every aspect of consumer entertainment – in or out of the home, on the go, in the air, at work, at play, or wherever life takes you,” said Kazuo Hirai, Executive Deputy President, Sony Corporation. “When these products are combined with Sony Entertainment Network (SEN) which offers innovative services like Music Unlimited and Video Unlimited, as well as PlayStation Network, the user experience is truly unmatched and only made possible by a company like Sony.”
Bringing this experience directly to consumers are Sony’s TVs, personal computers, smartphones and tablets — the primary four devices people use to play, watch, listen and share. Combined, they let consumers enjoy immersive content and unique applications across various screen sizes and devices.
“Our newest products continue Sony’s track record of ground-breaking innovation,” said Phil Molyneux, President and COO of Sony Electronics. “Sony’s goal is delivering the highest level of consumer entertainment, and we’re not satisfied with just making the best electronics. Our movies, music and games, combined with our development of emerging technologies like glass-less 3D and 4K technology, further demonstrate our commitment to consumers.”
At CES, Sony is also demonstrating a revolutionary new display technology called “Crystal LED Display.” This unique device is the industry’s first 55-inch Full HD self-emitting display using LEDs as the light source, and will be capable of much higher contrast, wider color range and superb video image response times. Sony is featuring a 55-inch prototype at CES.

Television/Home A/V
Sony’s expanded BRAVIA® television lineup focuses on three series – the entry-level BX, the step-up EX, and the flagship HX. The new models each deliver the best picture quality available and give consumers flexibility in choosing the right entertainment solution.
Select models incorporate and deliver a brilliant Full HD (1080p) picture with increased brightness and outstanding contrast. Sony’s OptiContrast panel elevates the picture to the front surface of the TV and creates a dark background for rich, vibrant, high contrast pictures even in well-lit rooms. Picture quality is further enhanced with Sony’s X-Reality PRO and X-Reality digital video processors, and Sony’s newest version of Motionflow XR technology helps to reduce blur caused by quick camera movements.
Sony is expanding its line of products using the Google TV platform, with a new network media player and a new Blu-ray Disc™ player. In addition, select 2012 BRAVIA models will link seamlessly for easier use of Google TV features.

Sony Tablet
One of Sony’s newest product categories, tablets elevate the user experience to entirely new levels. The first out of the gate, Sony Tablet S, is optimized for dynamic media entertainment on a large 9.4-inch display. Now, Sony Tablet P pushes the design of a tablet even further. Its unprecedented dual-screen layout allows its two 5.5-inch displays to be used for different functions such as playing video on one screen while using the other as a controller, or checking email on one screen while using the other as a keyboard. Users can also combine the displays into a single large screen and its unique folding design means it can fit easily into a jacket pocket or purse.

VAIO
Sony’s VAIO line of PCs continues to evolve to include more entertainment options and new designs to complement consumers’ productivity and mobility. At CES 2012, Sony is highlighting several new technologies as well as prototypes ranging from slate design PC and Ultrabook to all-in-one computers with BRAVIA technology and glass-less 3D capability.

Smartphones
One of Sony’s highest priorities is increasing its smartphone presence in North America. Sony Ericsson will become a wholly owned subsidiary of Sony under the new company name of “Sony Mobile Communications,” and new smartphones will be delivered under the “Sony” brand*.

Sony’s newest models combine sleek, slim designs and features to deliver a full HD experience. Users can enjoy movies, TV or Web content, capture HD memories and share them on any screen, and play HD gaming on any screen they choose.
The new Xperia™ ion is Sony’s first LTE smartphone with a stunning HD 720p Reality Display powered by Sony’s Mobile BRAVIA technology. Its thin, lightweight and durable aluminum body houses a 12 MP camera with blazing fast response times. The new Xperia S also provides a full HD experience plus 3D image capture, and more.

Digital Imaging
Sony is unveiling 13 new Handycam camcorder models. The newest Handycam enhancement is the world’s first stabilization system called “Balanced Optical Steady Shot.” By controlling the entire optical path, including the lens and the image sensor, as one floating unit, this technology cancels hand shake blur by up to 13 times more effectively than previous models.
Sony is also evolving its line of camcorders with built-in projectors by introducing a new, higher brightness model and accessories with enhanced audio capabilities, as well as a the world’s smallest and lightest camcorder 3D camcorder (HDR-TD20V). And “Bloggie Live” is the world’s first MP4 full HD pocket camera capable of live video streaming with built-in Wi-Fi. Sony is also introducing new Cyber-shot digital still cameras featuring high performance and compact, stylish designs, as well as a new after-shooting digital imaging solution named “Play Memories.”

Audio
Sony’s Walkman line of MP3 audio players is adding the Z Series. This flagship product adds a multi-application interface and new connectivity options to Sony’s Music Unlimited service and the Android market. Content from Z Series players can be sent wirelessly to certain DLNA enabled devices, or via HDMI to BRAVIA TVs.
Sony is offering up to 11 of its new Balanced Armature line of headphones, which deliver a wide variety of listening experiences. These micro-sized earbud style products are specially designed for style, comfort, sound insulation, sound leakage prevention and noise canceling.
Additionally, a focus on environmental sustainability will continue to result in new products that consume less power and energy and require fewer natural resources both in their design and packaging.
Sony has it all: products, content, services and connectivity to technologies for 2D, HD, 3D, and 4K, plus games and Grammy- and Academy Award-winning music and movies, as well as new releases and upcoming blockbusters like “Men in Black 3.”
“Sony creates and delivers more entertainment experiences to more people than anyone, anywhere,” said Sir Howard Stringer, chairman, CEO and president of Sony Corporation. “We will continue to create the best products in the world, the kind of things that make people say, ‘I have seen the future…and it’s a Sony.’”

sony.com

Sony Corporation (“Sony”) and Samsung Electronics Co., Ltd. (“Samsung”) today announced that the two companies have signed agreements to transition the current business relationship with respect to LCD panels.

Under the agreement, Samsung will acquire all of Sony’s shares of S-LCD Corporation (“S-LCD”), the two companies’ LCD panel manufacturing joint venture, making S-LCD a wholly owned subsidiary of Samsung. In consideration for the share transfer, cash consideration of approximately KRW 1.08 trillion* will be paid to Sony by Samsung. Concurrently, the two companies have entered into a new strategic agreement for the supply and purchase of LCD panels with a goal of enhancing the competitiveness of both companies. The agreement also allows Sony and Samsung to continue cooperative engineering efforts focused on LCD panel technology.

For Sony, this transaction will enable it to monetize its shares in S-LCD and aims to secure a flexible and steady supply of LCD panels from Samsung, based on market prices and without the responsibility and costs of operating a manufacturing facility. With whole ownership of S-LCD, Samsung anticipates heightened flexibility, speed and efficiency in both panel production and business operations.

Established in April 2004, S-LCD has continued to deliver advanced and cost-competitive LCD panels to both of its parent companies, contributing to the expansion of the respective parties’ TV businesses, and the large-sized LCD TV market overall. However, LCD panel and TV market conditions have now changed. In order to respond to such challenging conditions and to strengthen their respective market competitiveness, the two companies have agreed to shift to a new LCD panel business alliance.

The share transfer and payment are targeted to close by the end of January 2012, subject to necessary approvals from regulatory authorities.

As a result of this transaction, a non-cash impairment loss of approximately JPY 66 billion is expected to be incurred by Sony in the third quarter of the fiscal year ending March 31, 2012, due to the reevaluation of its S-LCD shares. This loss includes an impact from the fluctuation of exchange rate. Despite this one-time loss, Sony estimates that the transaction will result in substantial savings on and after January 1, 2012 in respect of costs associated with its procurement of LCD panels. The current estimate of the yearly savings in respect of such costs is approximately JPY 50 billion, compared to LCD panel procurement costs estimated for the fiscal year ending March 31, 2012. Neither the one-time loss nor the estimated cost savings were included in Sony’s forecast of consolidated financial results for the current fiscal year ending March 31, 2012, announced on November 2, 2011. Sony is currently reevaluating this forecast, taking into account this transaction and other factors that might affect its full year FY2011 consolidated financial results forecast.

Facts about S-LCD
Established
:April 26, 2004
Capital
:KRW 3.3 Trillion
(Samsung Electronics: 50% plus 1 share, Sony: 50% minus 1 share)

Representative
:Donggun Park, CEO
Location
:Tangjeong, Chung Cheong Nam-Do, South Korea
Production Items
:7th and 8th generation Amorphous TFT LCD
*Note: The final amount of such payment will be determined based on S-LCD’s financial statements as of the end of December 2011.

sony.net

Toshiba Corporation
Sony Corporation

Toshiba Corporation (“Toshiba”) and Sony Corporation (“Sony”) today announced that they had signed a non-binding memorandum of understanding expressing their intent to transfer from Toshiba to Sony the semiconductor fabrication facilities owned by Toshiba and operated by Nagasaki Semiconductor Manufacturing Corporation (“NSM”), a joint venture among Toshiba, Sony and Sony Computer Entertainment Inc. (“SCEI”), and, following the contemplated transfer, terminate their NSM joint venture relationship.

NSM, which was established in March 2008 and is located in the Nagasaki Technology Center of Sony Semiconductor Kyushu Corporation (“SCK”), has been manufacturing the high-performance “Cell Broadband Engine™” processor, the graphics engine “RSX” and other high-performance semiconductors and leading-edge SoC (system-on-a-chip) for applications in digital consumer products of Toshiba and Sony. The facilities to be transferred would be the fabrication facilities and equipment for the 300 mm wafer line located within the Nagasaki Technology Center purchased by Toshiba from Sony and SCK and leased to NSM in 2008 and other facilities that Toshiba and Sony will agree to transfer among those in which Toshiba invested in connection with the operation by NSM after the purchase.

After due diligence on the facilities to be transferred and continuing negotiations, Toshiba and Sony aim to execute definitive agreements (with respect to the contemplated transfer of the semiconductor fabrication facilities) as soon as possible before the end of the fiscal year ending March 31, 2011. Thereafter, Toshiba and Sony aim to complete the transfer early in the fiscal year ending March 31, 2012, subject to any necessary government approvals.

Outline of NSM
Establishment: March 3, 2008
Location: 1883-43, Tsukuba-machi, Isahaya-city, Nagasaki, Japan
Capital: 100 million yen
Ownership: Toshiba 60%, Sony 20% and SCEI 20%
Representatives: Masaaki Kinugawa, Chairman of the Board and Director(Chief Executive Officer)
Nobuhiro Yamaguchi, President and Director(Chief Operating Officer)
Business Activities: Manufacture of high-performance semiconductors, including the “Cell Broadband Engine™” processor and the graphics engine “RSX”
Number of employees: Approximately 460 as of December 1, 2010

sony.net

Dai Nippon Printing Co.,Ltd.
Sony Corporation

Dai Nippon Printing Co.,Ltd. (hereafter referred to as DNP) and Sony Corporation (hereafter referred to as Sony) have concluded an agreement in which Sony’s professional digital photo printer business (excluding the manufacture of printers) shall be transferred to DNP, and announced today the official execution of the business transfer agreement between the two parties. Accompanying the concerned agreement, DNP will establish a working framework in which dye-sublimation print media* is supplied without interruption throughout the business transfer proceedings to the instant photo printing kiosk and printers for ID photography currently installed by Sony.

Additionally, Sony will continue to maintain its medical-purpose professional printing business.

In the event that the concerned business transfer is subject to receipt of necessary approvals by the regulatory authorities of related governments in countries where the concerned business has a physical presence, and subject to appropriate country consultation with employees, the agreement shall be executed on the condition that such approval is granted. Execution of the transfer of business assets is scheduled for April 1, 2011.

The outline of the agreement is as follows:
1. Outline of the Agreement

Sony shall transfer all of its active business accounts from throughout the world, with regard to its professional digital photo printer business, to DNP. The transfer of a portion of Sony’s employees involved in the aforementioned business to DNP is also planned to accompany the agreement.

2. Purpose of Concerned Business Transfer

DNP commenced the manufacture of Dye-Sublimation Print Media* in the latter half of the 1980’s. It currently supplies this print media for the printing of digital images taken by digital cameras and mobile phones with built-in cameras to professional printers used in photo stores and large retailers throughout the world, in addition to consumer printers.

The dry-printing method in which the photo printing of digital images is processed without the use of liquid developers as in dye-sublimation printing, has become increasingly prevalent, and the introduction of new applications such as photo books has expanded the means by which consumers can enjoy printing images. Following the conclusion of the agreement, DNP shall be able to succeed Sony’s global customer base, thus enhancing efforts to strengthen and expand the company’s digital photo printing business in this growing market.

While Sony has operated its professional digital photo printer business, employing the thermal transfer dye-sublimation method, for instant photo printing and photo IDs since 2001, it has decided to concentrate its efforts on select businesses that will enable it to further enhance the future competitiveness of its professional solutions business.

With regard to its professional printer business, the company shall now specialize in the medical-purpose segment, and continue efforts to strengthen the business.

* Dye-Sublimation Print Media
Media that is used for the printing of photographs such as digital images using the thermal-transfer printing method. It is composed of a transparent overcoat layer on a 3-color ink ribbon including yellow, magenta and cyan, and specialized receiver paper. The transfer of dye according to image density allows for smooth gradation, enabling the recreation of high-quality images. The media also allows for high-speed printing, and its extended durability has expanded its use as printing media for images taken by digital cameras mainly in such devices as household photo printers, kiosk devices and photo IDs.

sony.net

Also announces industry’s smallest and thinnest*1 lens module for mobile phones

October 7, 2010, Tokyo, Japan – Sony Corporation (hereafter, “Sony”) today announced the commercialization of two new “Exmor R” back-illuminated CMOS image sensors with dramatically improved photographic performance including significantly high sensitivity and low noise. In addition, Sony will launch two new lens modules equipped with these image sensors, which also include the smallest and thinnest*1 model for mobile phones. This is also the first time that “Exmor R” is commercialized for the use in mobile phones.
*1 As of October 7, 2010

Lens modules: “IU081F” (left), “IU105F2″ (right)
“Exmor R” back-illuminated CMOS image sensors:”IMX081PQ” (left), “IMX105PQ” (right)

Model Name Shipment date (Plan) Sample price
Type 1/2.8 16.41 effective megapixels
back-illuminated CMOS image sensor
“IMX081PQ” January, 2011 2,500 JPY
Type 1/3.2 8.13 effective megapixels
back-illuminated CMOS image sensor
“IMX105PQ” April, 2011 1,500 JPY
Type 1/2.8 16.41 effective megapixels*2
Lens module “IU081F” March, 2011 12,000 JPY
Type 1/3.2 8.13 effective megapixels*2
Lens module “IU105F2″ April, 2011 8,000 JPY
*2 Based on the effective pixels of the image sensor

“IMX081PQ” is world’s first*1 type 1/2.8 back-illuminated CMOS image sensor which realizes 16.41 effective megapixel resolution, and adopts the industry’s smallest*1 unit pixel size of 1.12μm. “IMX105PQ” is a type 1/3.2 back-illuminated CMOS image sensor which realizes 8.13 effective megapixel resolutions for higher sensitivity and adopts a unit pixel size of 1.4μm. By embedding these highly sensitive sensors into mobile phones, including those without camera flash, users can capture high quality photos and videos even in low light settings.
Furthermore, Sony will commercialize “IU081F” and “IU105F2″ compact auto-focus lens modules which include the two new “Exmor R” back-illuminated CMOS image sensors. These down-sized modules are suitable and efficient for mobile phones with relatively limited space and are equipped with high performance lens which maximize the image sensors’ respective performances. “IU081F” is the industry’s smallest and thinnest*1 auto-focus lens module (W10.5 X D10.5 X H7.9mm) and is equipped with the 16.41 effective megapixel*2 CMOS image sensor. “IU105F2″ adopts the 8.13 effective megapixel*2 CMOS image sensor, and belongs in the industry’s smallest and thinnest*3 size class (W8.5 X D8.5 X H5.67mm).
Through its proprietary fine pixel fabrication process technology, Sony will proactively continue the development of “Exmor R” which adopts the 1.12μm unit pixel size for mobile phones. Accordingly, Sony aims to address customer demand by providing appropriately small lens modules especially for smartphones with large displays and limited space for components.

About the realization of high resolution
“IMX081PQ” is world’s first*1 type 1/2.8 back-illuminated CMOS image sensor which realizes 16.41 effective megapixel resolution, and adopts the industry’s smallest*1 unit pixel size of 1.12μm achieved by the fine pixel fabrication process technology. In theory, when a unit pixel size is made smaller, there are also some issues such as color mixture among smaller unit pixels. Sony solved this problem by implementing a unique formation of photo diodes optimally designed for fine pixel structure to realize a CMOS image sensor with high resolution, high sensitivity and low noise.

About manufacturing
Since 2009, Sony has been mass producing “Exmor R” for Digital Still Cameras and Digital Video Camcorders on wafer lines (with diameter of 200mm) at Sony Semiconductor Kyushu Corporation’s Nagasaki Technology Center. At the end of 2010, Sony plans to start the mass production of “Exmor R,” including those for mobile phones announced today, at Sony Semiconductor Kyushu Corporation’s Kumamoto Technology Center, on cutting-edge wafer lines (with diameter of 300mm). Sony already announced (September 1, 2010) the investment of approximately 40 billion yen in Kumamoto Technology Center to increase production capacity for CMOS image sensors.

About Back-illuminated CMOS image sensor “Exmor R”
Sony first announced the development of “Exmor R” on Jun, 2008. “Exmor R” has been incorporated in Sony’s digital imaging products since 2009, and its use in other products has continued to expand. “Exmor R” CMOS image sensor features Sony’s independently developed back-illuminated structure, realizing significantly higher sensitivity as well as lower noise. In this back-illuminated CMOS image sensor, light is directed onto the silicon substrate from behind, allowing light to be used with a level of efficiency not possible with conventional front-illuminated structures.

Main features

1) CMOS image sensor with the world’s first*1 16.41 effective megapixel resolution for use in mobile phones. (“IMX081PQ”)
–adopts formation technology used to create industry’s smallest*11.12µm unit pixel
2) Realizes high sensitivity and low noise through back-illuminated structure.
3) Adopts Sony’s proprietary “Column-Parallel A/D Conversion Technique”, providing each column within the sensor with its own A/D converter, achieving high frame rates of 15 frame/sec (in all-pixel scan mode) and Full-HD video taking capability.

1) The industry’s smallest and thinnest*1 lens module equipped with CMOS image sensor, lens and auto-focus functions in which the pixel structure and lens are optimally designed. (“IU081F”)
2) Approximately twice as sensitive as a conventional front-illuminated CMOS image sensor by combining back-illuminated CMOS image sensor and bright lens with small f-number. (“IU105F2″)
3) Equipped with 28mm wide-angle lens (35mm conversion) which is convenient for daily shooting.

Key specifications

Model Name IMX081PQ IMX105PQ
Number of effective pixels 4672(H)×3512(V)
16.41M pixels 3288(H)×2472(V)
8.13M pixels
Image size Diagonal 6.5mm (Type1/2.8)
square pixel Diagonal 5.76mm (Type 1/3.2)
square pixel
Unit cell size 1.12μm□ 1.4μm□
Frame
rate Full 15fps 15fps
1/2 sub sampling 30fps 30fps
1/8 sub sampling 120fps 120fps
HD mode 1080-30P / 720-60P 1080-30P / 720-30P
Sensitivity 205 digit (10Bit) 310 digit (10Bit)
Saturation signal 820 digit (10Bit) 1023 digit (10Bit)
Power supply Analog 2.7 +0.2/-0.1V 2.7 +0.2/-0.1V
Digital 1.2 ±0.1V 1.2 ±0.1V
Interface 1.8 ±0.1V 1.8 ±0.1V
Major function 3-wire serial communication, I2C, serial data output, supports flexible input clock
Output MIPI 4,2,1 Lane MIPI 2,1 Lane

Model Name IU081F IU105F2
Module size*2 10.5(W)×10.5(D)×7.9(H)mm 8.5(W)×8.5(D)× 5.67(H)mm
AF actuator Voice coil motor
Lens construction 4 groups 4 elements (Plastic)
F-number F2.6 F2.4
Focal length (35mm conversion) 28mm
Camera output MIPI (4 Lane) MIPI (2 Lane)

*1 As of October 7, 2010
*2 Based on the effective pixels of the image sensor
*3 Compared to CMOS image sensor with the same pixel count as of October 7, 2010
*4 Dimensions show width and depth excluding flexible printed circuits

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